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2YRSShenzhen Weifengheng Technology Co., Ltd.

公司概览

公司相册

基础信息

产品容量

生产流程

Die Bonding
The Die Bonding is the first and most important procedure for packaging MEMS sensor. CFSensor own six AD830 machines and two bonding engineers.
Wire Bonding
The Wire Bonding is the second and very important procedure for packaging MEMS sensor. CFSensor own 18 piece KS machines and two bonding engineers.
Dispensing
Dispensing is gluing for back cover after wire bonding
Heating
The glue need be solidified after Die bonding and Dispensing
Marking
Marking the data/batch etc, information on back of sensor

生产设备

产品名称
数量
验证
Die Bonding Machine
Datacon
1
Die Bonding Machine
AD830
6
Wire Bonding Machine
KS Maxum ultra
18
Heating Machine
MD-520A-X
3
Push-pull Machiine
MFM1200
2
Test Machine
WFH231
4
SMT Packing Machine
WFH430
1
Punching Machine
WFH501
3
验证

工厂信息

厂房面积
1,000-3,000 square meters
工厂位置
East 2/F, Building B, Huafeng Gongle Industrial Park, Xixiang, Baoan District ShenZhen China
生产线数量
3
合同制造
OEM Service Offered, Design Service Offered, Buyer Label Offered
年产值
US$10 Million - US$50 Million

年生产能力

产品名称
台产
HighestEver
UnitType
验证
High precision digital pressure sensors
50000000
60000000
Piece/Pieces
验证

生产线

生产线
主管
NO.算子
NO.直插 QC/QA
验证
Die Bonding
1
2
1
Wire Bonding
1
2
1
Punching Line
1
2
1
Automotive Test Line
1
2
2
SMD Packing Line
1
1
1
Calibration Line
2
5
2
验证

质量控制

质量管理过程

Pressure Sensor Calibration
Mainly including incoming materials, welding, calibration, temperature compensation, testing, factory inspection, etc.,

测试设备

机器名称
品牌及型号
数量
验证
Digital Multimeter
Agilent 34401A
13
Oscillograph
KEYSIGHT DSOX1202A
5
Oscillograph
Tektronix TK9527
3
验证