Descripción general de la empresa - Shenzhen Weifengheng Technology Co., Ltd.

2YRSShenzhen Weifengheng Technology Co., Ltd.

Die Bonding

The Die Bonding is the first and most important procedure for packaging MEMS sensor. CFSensor own six AD830 machines and two bonding engineers.

Wire Bonding

The Wire Bonding is the second and very important procedure for packaging MEMS sensor. CFSensor own 18 piece KS machines and two bonding engineers.

Dispensing

Dispensing is gluing for back cover after wire bonding

Heating

The glue need be solidified after Die bonding and Dispensing

Marking

Marking the data/batch etc, information on back of sensor

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Tamaño de la fábrica	1,000-3,000 square meters
Ubicación de la fábrica	East 2/F, Building B, Huafeng Gongle Industrial Park, Xixiang, Baoan District ShenZhen China
N° de líneas de producción	3
Fabricación por contrato	OEM Service Offered, Design Service Offered, Buyer Label Offered
Valor de producción anual	US$10 Million - US$50 Million

Nombre del producto	Unidades producidas	HighestEver	UnitType	Verificado

High precision digital pressure sensors

50000000

60000000

Piece/Pieces

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Línea de producción	Supervisor	NO, de los operadores	NO, de en-línea QC/QA	Verificado

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Pressure Sensor Calibration

Mainly including incoming materials, welding, calibration, temperature compensation, testing, factory inspection, etc.,

Nombre de la máquina	Marca y modelo NO	Cantidad	Verificado

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