Sign in
2YRSShenzhen Weifengheng Technology Co., Ltd.

COMPANY OVERVIEW

Company Album

Basic Information

PRODUCT CAPACITY

Production Flow

Die Bonding
The Die Bonding is the first and most important procedure for packaging MEMS sensor. CFSensor own six AD830 machines and two bonding engineers.
Wire Bonding
The Wire Bonding is the second and very important procedure for packaging MEMS sensor. CFSensor own 18 piece KS machines and two bonding engineers.
Dispensing
Dispensing is gluing for back cover after wire bonding
Heating
The glue need be solidified after Die bonding and Dispensing
Marking
Marking the data/batch etc, information on back of sensor

Production Equipment

Name
No
Quantity
Verified
Die Bonding Machine
Datacon
1
Die Bonding Machine
AD830
6
Wire Bonding Machine
KS Maxum ultra
18
Heating Machine
MD-520A-X
3
Push-pull Machiine
MFM1200
2
Test Machine
WFH231
4
SMT Packing Machine
WFH430
1
Punching Machine
WFH501
3
Verified

Factory Information

Factory Size
1,000-3,000 square meters
Factory Country/Region
East 2/F, Building B, Huafeng Gongle Industrial Park, Xixiang, Baoan District ShenZhen China
No. of Production Lines
3
Contract Manufacturing
OEM Service Offered, Design Service Offered, Buyer Label Offered
Annual Output Value
US$10 Million - US$50 Million

Annual Production Capacity

Product Name
units Produced
highestEver
unit Type
Verified
High precision digital pressure sensors
50000000
60000000
Piece/Pieces
Verified

Facilities

Facilities
Supervisor
NO.of Operators
NO.of In-line QC/QA
Verified
Die Bonding
1
2
1
Wire Bonding
1
2
1
Punching Line
1
2
1
Automotive Test Line
1
2
2
SMD Packing Line
1
1
1
Calibration Line
2
5
2
Verified

QUALITY CONTROL

Quality Management Process

Pressure Sensor Calibration
Mainly including incoming materials, welding, calibration, temperature compensation, testing, factory inspection, etc.,

Test Equipment

Machine Name
Brand & Model NO
Quantity
Verified
Digital Multimeter
Agilent 34401A
13
Oscillograph
KEYSIGHT DSOX1202A
5
Oscillograph
Tektronix TK9527
3
Verified